HBFDF04 Series

Intel® Elkhart Lake SoC processor, DDR4 up to 32GB, 2* HDMI, 12~24V DC-in

Description

FEATURES

  • Intel® Elkhart Lake SoC Processor (Default: J6412)
  • Support 2 * SO-DIMM DDR4-3200MHz up to 32GB
  • All-aluminum body, produced by casting process
  • 12~24V DC-in

Front

Back

Mechanical

MB Model – MF04-03B (J6412 CPU_10W, 32GB eMMC, Default)
– MF04-07B (J6412 CPU_10W, 32GB eMMC, TPM2.0)
Part No Non-Wifi M.2 ac WiFi card TPM2.0
– HBFDF04-6412-B (Default) – HBFDF04I-6412-B – HBFDF04-6412-T
BIOS – AMI Flash ROM
CPU/Chipset – Intel® Elkhart Lake SoC Processor (Default: J6412, TDP 10W)
Memory – 2* SO-DIMM slots DDR4-3200MHz up to 32GB
Network – 1* Intel® i211AT GbE
– 1* Intel® i225V 2.5GbE
Storage – 1* SATAIII
– 32GB onboard eMMC (default)
– 1* M.2 M-key (2242/2280) PCIe Gen.3 x2/SATA interface Support NVME
Expansion slot – 1* M.2 B-key (3042) Support USB3.1/USB2.0 interface
– 1* M.2 E-key (2230) Support USB2.0/PCIe Gen.3 x1 interface
Rear Panel I/O – 3* USB3.1 (Gen2)
– 3* USB2.0
– 2* HDMI
– 2* RJ45
– Line-out/MIC combo jack
– DC-in (12~24V)
Front Panel I/O – 1* Power SW, 1* Reset
– 1* Power LED, 1* HDD LED
– 1* MIC
– 1* Line-out
– 2* COM (COM1 support RS485)
– 2* USB2.0
Compliance – CE, FCC, LVD, RoHS, ErP Ready
Power Source – Adapter / AC 90~240V input / DC12V-60W
– MB: support 12~24V DC-in
Temperature – Operating Temperature: 0 ~ 50° C
– Storage Temperature: -20 ~ 85° C
– Humidity: 10% ~ 90% RH @40°C (non-condensing)
Dimensions – 193 (W) x 142.4 (D) x 62 (H) mm
Packing – Net Weight: 2.2KG
– Gross Weight: 3.5KG
– Color Box dimension: 250 (W) * 118 (D) * 295 (H) mm
OS Support – Windows 10, Linux
Warranty – 2 Year limited warranty
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